Cover of an electronic device having surface ornamentation



The present application is related to co-pending U.S. patent application Ser. No. 29/419,162, entitled “Cover of an Electronic Device Having Surface Ornamentation”, by Bin Li. This application has the same assignee as the present application and has been concurrently filed herewith. The above-identified application is incorporated herein by reference.

FIG. 1 is a perspective view of a cover of an electronic device having surface ornamentation showing my new design;

FIG. 2 is a front elevational view thereof;

FIG. 3 is a side elevational view thereof; and,

FIG. 4 is an enlarged fragmentary view thereof showing circled portion IV in FIG. 2.

In FIGS. 1-3, the evenly segmented broken lines indicate portions of the cover of an electronic device having surface ornamentation that form no part of the claimed design. In FIGS. 2 and 4, the unevenly segmented broken lines indicate the portion of the design that is shown on an enlarged scale in FIG. 4. The broken lines form no part of the claimed design. 

The ornamental design for a cover of an electronic device having surface ornamentation, as shown and described. 